Semiconductor device and method for manufacturing semiconductor device
US7714448B2 · kind B2 · utility
8Cited by
0References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 16, 2005 |
| Grant date | May 11, 2010 |
| Priority date | — |
| Expiry date | Mar 22, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An inventive semiconductor device includes a semiconductor chip having a passivation film, and a sealing resin layer provided over the passivation film for sealing a front side of the semiconductor chip. The sealing resin layer extends to a side surface of the passivation film to cover the side surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.