Ultrasonic sensor
US7714482B2 · kind B2 · utility
2Cited by
8References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 9, 2008 |
| Grant date | May 11, 2010 |
| Priority date | — |
| Expiry date | Sep 9, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R17/02
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An ultrasonic sensor is disclosed. The ultrasonic sensor includes a plurality of sensor elements arranged in an array. Each sensor element includes an ultrasonic sensing element and an acoustic matching member. The ultrasonic sensor further includes a bonding member having a thickness approximately equal to a space interval between adjacent ultrasonic sensing elements. The bonding member adhesively fixes the plurality of sensor elements, and includes a portion contacting each ultrasonic sensing element. An elastic modulus of the portion is smaller than that of each ultrasonic sensing element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.