Embedded type multifunctional integrated structure and method for manufacturing the same
US7715164B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 20, 2007 |
| Grant date | May 11, 2010 |
| Priority date | — |
| Expiry date | Nov 3, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/239
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An embedded type multifunctional integrated structure and a method for manufacturing the same are disclosed. The present invention utilizes the concept of multi-layer design to integrated more than two passive components on a component structure that would be adhered to a substrate. Hence, the embedded type multifunctional integrated structure has an OCP function, an OVP function, an anti-EMI function, and an anti-ESD function at the same time. Therefore, the present invention effectively integrated two or more than one passive components in order to increase function of the embedded type multifunctional integrated structure. Moreover, the present invention effectively reduces the size of the passive components on a PCB and reduces the number of solder joints.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.