Stacked semiconductor module, method of fabricating the same, and electronic system using the same
US7715200B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 26, 2008 |
| Grant date | May 11, 2010 |
| Priority date | — |
| Expiry date | Oct 29, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1572
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A stacked semiconductor module, a method of fabricating the same, and an electronic system using the module are provided. A first semiconductor module having a plurality of semiconductor devices mounted on a rigid printed circuit board (PCB) and a second semiconductor module having a plurality of other semiconductor devices mounted on a flexible PCB are provided. On the rigid PCB a number L of first tabs may be disposed on a first surface, and a number K of second tabs may be disposed on a second surface of the rigid PCB. The flexible PCB may have a number M of third tabs on a third surface, and a number N of fourth tabs on a fourth surface of the flexible PCB. The second tabs may be combined with the third tabs using a conductive adhesive. The third tabs may be electrically connected to corresponding ones of the second tabs.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.