Patent · US Active

Bonding an interconnect to a circuit device and related devices

US7716823B2 · kind B2 · utility

0Cited by
10References
52Claims
0Family size

Assignee

Inventors

Key dates

Filing dateApr 8, 2004
Grant dateMay 18, 2010
Priority date—
Expiry dateFeb 15, 2028

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T29/49133
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

This disclosure relates to a system and method for bonding an interconnect to a dense circuit device with a mechanically clamping substrate.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.