High density fiber optic interconnect system with push-release mechanism and method for using same
US7717625B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 13, 2007 |
| Grant date | May 18, 2010 |
| Priority date | — |
| Expiry date | Aug 13, 2027 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/3897
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An optical fiber interconnect system wherein the adapter is connected to and released from the holder and the connector is connected to and released from adapter through two push-release connection and release mechanisms. The connector is engaged with the adapter by applying an insertion force to the connector. The connector is released by applying a releasing force to the connection mechanism on the adapter. The system of the invention includes a holder for attachment of the adapter to a front panel. A release opening is provided on the holder for the release of the adapter from the holder from the front of the panel so as to provide access to the back connector.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.