Conductive paste
US7718090B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 13, 2003 |
| Grant date | May 18, 2010 |
| Priority date | — |
| Expiry date | Apr 1, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/4069
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention provides an electroconductive paste that can contain a high proportion of an electroconductive powder, has excellent electroconductivity reliability and migration resistance, has a highly competitive price due to a reduced amount of silver plating, and is suitable for use in solder electrode formation, an electroconductive adhesive, etc. The electroconductive paste of the present invention comprises a binder and an electroconductive powder containing 80 to 97 wt % of a substantially spherical silver-coated copper powder in which the surface of a copper powder is coated with silver and the surface thereof is further coated with 0.02 to 0.5 wt % relative to the copper powder of a fatty acid, and 3 to 20 wt % of a flat-shaped silver-coated copper powder in which the surface of a copper powder is coated with silver and the surface thereof is further coated with 0.02 to 1.2 wt % relative to the copper powder of a fatty acid.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.