Patent · US Active

Method for producing an optoelectronic device with patterned-metallized package body and method for the patterned metalization of a plastic-containing body

US7718451B2 · kind B2 · utility

1Cited by

12References

14Claims

0Family size

Assignee

OSRAM Opto Semiconductors GmbH · DE

Inventors

Thomas Hofer · Auenwald, DE
Herbert Brunner · Sinzing, DE
Frank Möllmer · Bad Abbach, DE
Gunter Waitl · Regensburg, DE
Rainer Sewald · Taufkirchen, DE
Markus Zeiler · Nittendorf, DE

Key dates

Filing date	Jul 23, 2007
Grant date	May 18, 2010
Priority date	—
Expiry date	Feb 12, 2028

Classification

Technology area (CPC H)Electricity
CPC primaryH10H20/857
WIPO fieldOther special machines
WIPO sectorMechanical engineering

Abstract

A method for patterned metallization of a plastic-containing body, which comprises the steps of producing the body via a two-component injection-molding process with at least two plastics, one of which is non-metallizable, and metallizing the body in such a way that a metallized region and a non-metallized region are formed, wherein the non-metallized region is determined by the non-metallizable plastic. A method for the patterned metallization of a plastic-containing body in particular a package body for an optoelectronic device is also provided.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.