Die temperature sensors
US7718967B2 · kind B2 · utility
5Cited by
31References
62Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 20, 2006 |
| Grant date | May 18, 2010 |
| Priority date | — |
| Expiry date | Oct 20, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The invention provides a sensor array having a plurality of sensor elements formed in a first substrate and having a plurality of die temperature sensors located thereabout. Each of the die temperature sensors are configured to provide an output related to the temperature of the die on which they are located, the sensor elements providing an output indicative of the intensity of radiation incident thereon.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.