Laminated magnetic material for inductors in integrated circuits
US7719084B2 · kind B2 · utility
46Cited by
2References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 30, 2006 |
| Grant date | May 18, 2010 |
| Priority date | — |
| Expiry date | Jan 15, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01F17/0006
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An embodiment is an inductor that may include a laminated material structure to decrease eddy currents therein that may limit the operation of the inductor at high frequency. An embodiment may employ electroless plating techniques to form a layer or layers of magnetic material within the laminated material structure, and in particular those magnetic layers adjacent to insulator layers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.