Semiconductor device and method for manufacturing a semiconductor device
US7719096B2 · kind B2 · utility
1Cited by
14References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 9, 2007 |
| Grant date | May 18, 2010 |
| Priority date | — |
| Expiry date | Jul 9, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/13091
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device mountable to a substrate is provided. The device includes a semiconductor die and an electrically conductive attachment region having a first attachment surface and a second attachment surface. The first attachment surface is arranged for electrical communication with the semiconductor die. An interlayer material is formed on the second attachment surface of the electrically conductive attachment region. The interlayer material is a thermally conductive, dielectric material. A housing at least in part encloses the semiconductor die and the interlayer material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.