Package structure for solid-state lighting devices and method of fabricating the same

US7719099B2 · kind B2 · utility

Assignee

• ADVANCED OPTOELECTRONIC TECHNOLOGY, INC. · TW

Inventors

• Wen-Liang Tseng · Hsinchu, TW
• LUNG-HSIN CHEN · Hsinchu, TW

Key dates

• Filing date: Oct 16, 2006
• Grant date: May 18, 2010
• Expiry date: Mar 22, 2027

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10H20/8585

Abstract

Silicon substrates are applied to the package structure of solid-state lighting devices. Wet etching is performed to both top and bottom surfaces of the silicon substrate to form reflecting cavity and electrode access holes. Materials of the reflecting layer and electrode can be different from each other whose preferred materials can be chosen in accordance with a correspondent function. Formation of the electrode can be patterned by an etching method or a lift-off method.