Flexible interconnect cable for an electronic assembly
US7719378B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 22, 2008 |
| Grant date | May 18, 2010 |
| Priority date | — |
| Expiry date | Jan 22, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10734
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A high speed flexible interconnect cable for an electronic assembly includes a number of conductive layers and a number of dielectric layers. Conductive signal traces, located on the conductive layers, combine with the dielectric layers to form one or more high speed electrical transmission line structures. The cable can be coupled to electronic components using a variety of connection techniques. The cable can also be terminated with any number of known or standardized connector packages.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.