Laminated electronic component and method for manufacturing the same
US7719819B2 · kind B2 · utility
14Cited by
3References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 6, 2008 |
| Grant date | May 18, 2010 |
| Priority date | — |
| Expiry date | Mar 6, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/435
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A method for manufacturing a laminated electronic component is performed such that a water-repellent agent is applied to end surfaces at which ends of internal electrodes are exposed so as to be filled in spaces along interfaces between insulating layers and the internal electrodes. Subsequently, an abrading step is performed such that the internal electrodes are sufficiently exposed at the end surfaces and an excess water-repellent agent is removed therefrom to enable plating films to be directly formed on the end surfaces.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.