Fingerprint recognition module having a thin-film structure and comprising resistive, temperature-sensitive elements

US7720265B2 · kind B2 · utility

Assignee

• Inabillion AS · NO

Inventors

• Burkhard Büstgens · Gundelfingen, DE
• Gerald Urban · Neuzelle, DE
• Joachim Aurich · Welmbüttel, DE
• Gunter Igel · Teningen, DE

Key dates

• Filing date: May 15, 2003
• Grant date: May 18, 2010
• Expiry date: Jan 28, 2025

Classification

• Technology area (CPC G): Physics
• CPC primary: G06V40/1306
• WIPO field: Computer technology
• WIPO sector: Electrical engineering

Abstract

The invention relates to a fingerprint recognition module comprising a substrate consisting of a material that is electrically insulating at least on its upper side and at least partially thermally insulating. Said substrate receives a composite of structured thin films on its surface, which directly forms a measuring field on the surface of the substrate for measuring a fingerprint. Said composite consists of an array of resistive, temperature-dependent elements, and contains strip conductors which connect the resistive, temperature-dependent elements to at least one connection field located on the substrate, outside the measuring field, and form part of the composite of structured thin films. The substrate also contains at least one microelectronic switching circuit which is electrically connected to the at least one connection field and contains the switching circuits by which means the thin film structures are controlled in order to heat the resistive, temperature-sensitive elements, the resistive, temperature-sensitive elements are read out, and the data is retransmitted.