Patent · US Active

Method of fabricating a printhead integrated circuit attachment film

US7721441B2 · kind B2 · utility

1Cited by

5References

18Claims

0Family size

Assignee

Silverbrook Research Pty Ltd · AU

Inventors

Nagesh Ramachandra · Sydney, AU
Brian Robert Brown · Chatswood, AU
Norman Micheal Berry · Sydney, AU
Garry Raymond Jackson · Sydney, AU
Paul Timothy Sharp · Sydney, AU
John Douglas Peter Morgan · Sydney, AU
Kia Silverbrook · Sydney, AU
Akira Nakazawa · Yokohama, JP
Michael John Hudson · Sydney, AU
Christopher Hibbard · Sydney, AU
Samuel George Mallinson · Sydney, AU
Paul Justin Reichl · Sydney, AU

Key dates

Filing date	Apr 29, 2007
Grant date	May 25, 2010
Priority date	—
Expiry date	Jul 9, 2027

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T29/49401
WIPO fieldTextile and paper machines
WIPO sectorMechanical engineering

Abstract

A method of fabricating a film for attachment of one or more printhead integrated circuits to an ink supply manifold is provided. The method comprises the steps of: (a) providing an adhesive polymeric film having a protective liner; (b) depositing photoresist onto the protective liner; (c) photopatterning the photoresist to define a plurality of openings positioned for etching supply holes through the film; (d) etching the plurality of ink supply holes through the film, the photoresist acting as a mask for the etch; and (e) removing the protective liner having the photoresist deposited thereon.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.