Modified heat pipe for activation of a pressure relief device
US7721750B2 · kind B2 · utility
5Cited by
11References
20Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 18, 2007 |
| Grant date | May 25, 2010 |
| Priority date | — |
| Expiry date | Jan 8, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T137/1963
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A heat pipe is disclosed, the heat pipe capable of transferring heat to actuate a pressure relief device by heat transfer through either capillary action involving a wicking material and a working fluid, or by a consumable fuse in the case of leakage of the working fluid from the heat pipe.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.