Injection mold and partial compression molding method
US7722792B2 · kind B2 · utility
45Cited by
5References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 30, 2008 |
| Grant date | May 25, 2010 |
| Priority date | — |
| Expiry date | Jul 18, 2028 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29C45/572
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
In an injection mold, a compression pin is placed at a cavity surface by the pressing force of a biasing member, and is moved rearward by the pressure of filled resin so as to form a compression boss. After the completion of filling, the compression boss is compressed by the compression pin.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.