Patent · US Active

Encapsulation in a hermetic cavity of a microelectronic composite, particularly of a MEMS

US7723141B2 · kind B2 · utility

14Cited by

3References

17Claims

0Family size

Assignee

COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES · FR

Inventor

Philippe Robert · Grenoble, FR

Key dates

Filing date	Mar 12, 2007
Grant date	May 25, 2010
Priority date	—
Expiry date	Apr 10, 2027

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB81C2203/0145
WIPO fieldMicro-structural and nano-technology
WIPO sectorChemistry

Abstract

To produce a structure of a micro-electro-mechanical system (MEMS) in a hermetic cavity (38) of a microelectronic device (50), a prepared cover (30) and substrate (10) are bonded by means of silicon direct bonding (SDB). To optimise the preparation of surfaces by means of wet cleaning without impairing the properties of the MEMS (22), i.e. without causing adhesions, the MEMS structure (22) is not released during bonding, but attached to the base (12) by means of a sacrificial intermediate layer (16). Said layer is removed once bonding has been carried out by injecting HF vapour via a vent (40) opening into the cavity (38).

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.