Method and system for flip chip packaging of micro-mirror devices
US7723144B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Feb 28, 2008 |
| Grant date | May 25, 2010 |
| Priority date | — |
| Expiry date | Feb 28, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F77/50
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A package for a micro-electromechanical device includes a substrate adapted to support the micro-electromechanical device. The micro-electromechanical device is electrically coupled to a plurality of electrodes. The package also includes a thermally conductive structure coupled to the substrate, an electrical contact layer having a plurality of traces in electrical communication with the plurality of electrodes, and an interposer structure coupled to the substrate. The interposer structure includes a continuous annular region defining a recessed region bounded by a bond surface. The package further includes a transparent cover coupled to the interposer structure and sealing the micro-electromechanical device in the recessed region to isolate the micro-electromechanical device in a controlled environment.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.