Composite moldings and a method of manufacturing the same
US7723619B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 19, 2004 |
| Grant date | May 25, 2010 |
| Priority date | — |
| Expiry date | Feb 16, 2026 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29L2031/3061
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Continuous annular resin bands surrounding electrical contact portions of respective terminals are disposed without gaps between the electrical contact portions of respective terminals and resin members that fixedly hold the terminals; there are formed gaps among the adjoining resin bands. Gaps are formed among a bundle of terminals having annular resin bands and resin members surrounding the bundle. A partial adhesion is formed at the interface between the terminals and the resin by a low cost manufacturing method, whereby a molding with high air-tightness between the interior and exterior thereof and high reliability is realized.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.