Laser-based system for memory link processing with picosecond lasers
US7723642B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 10, 2003 |
| Grant date | May 25, 2010 |
| Priority date | — |
| Expiry date | Feb 1, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/0026
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A laser-based method of removing a target link structure of a circuit fabricated on a substrate includes generating a pulsed laser output at a pre-determined wavelength less than an absorption edge of the substrate. The laser output includes at least one pulse having a pulse duration in the range of about 10 picoseconds to less than 1 nanosecond, the pulse duration being within a thermal laser processing range. The method also includes delivering and focusing the laser output onto the target link structure. The focused laser output has sufficient power density at a location within the target structure to reduce the reflectivity of the target structure and efficiently couple the focused laser output into the target structure to remove the link without damaging the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.