Laser peening for reducing hydrogen embrittlement

US7723643B2 · kind B2 · utility

Assignees

• Lawrence Livermore National Security, LLC · US
• The Regents of the University of California · US

Inventors

• Lloyd Hackel · Livermore, US
• Tania M. Zaleski · Livermore, US
• Hao Chen · Walnut Creek, US
• Michael R. Hill · Wantage, GB
• Kevin K. Liu · Sandy, US

Key dates

• Filing date: Apr 6, 2006
• Grant date: May 25, 2010
• Expiry date: Nov 29, 2028

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B23K26/356
• WIPO field: Machine tools
• WIPO sector: Mechanical engineering

Abstract

A laser peening process for the densification of metal surfaces and sub-layers and for changing surface chemical activities provides retardation of the up-take and penetration of atoms and molecules, particularly Hydrogen, which improves the lifetime of such laser peened metals. Penetration of hydrogen into metals initiates an embrittlement that leaves the material susceptible to cracking.