Patent · US Expired

Carrier layer for a semiconductor layer sequence and method for producing semiconductor chips

US7723730B2 · kind B2 · utility

6Cited by

7References

28Claims

0Family size

Assignee

OSRAM Opto Semiconductors GmbH · DE

Inventors

Stefan Groetsch · Bad Abbach, DE
Stefan Illek · Donaustauf, DE
Andreas Ploessl · Regensburg, DE
Berthold Hahn · Hemau, DE

Key dates

Filing date	Nov 29, 2004
Grant date	May 25, 2010
Priority date	—
Expiry date	Nov 29, 2024

Classification

Technology area (CPC H)Electricity
CPC primaryH10H20/8585
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A carrier layer (1) for a semiconductor layer sequence comprising an electrical insulation layer (2) containing AlN or a ceramic. Furthermore a method for producing semiconductor chips is described.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.