Pad and circuit board, electronic device using same
US7723855B2 · kind B2 · utility
8Cited by
12References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 29, 2007 |
| Grant date | May 25, 2010 |
| Priority date | — |
| Expiry date | May 23, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24942
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A pad for soldering a contact of a surface mounted component is provided herein. The pad includes a central portion and a plurality of separate extending portions extending from the central portion. All of the plurality of separate extending portions includes a free end and a connected end connected to the central portion. A width of the free end is larger than a width of the connected end. A circuit board and an electronic device are also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.