Printed circuit boards with a multi-plane antenna and methods for configuring the same
US7724193B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 17, 2007 |
| Grant date | May 25, 2010 |
| Priority date | — |
| Expiry date | Sep 5, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01Q11/08
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
Multi-plane antennae on a substrate having a front face and a back face are provided. A plurality of through holes extend through the substrate between the front face and the back face of the substrate. A first antenna component is on the front face of the substrate and a second antenna component is on the back face of the substrate. A conductive via extends through a selected one of the through holes that electrically connects the first antenna component and the second antenna component to define the multi-plane antenna on the substrate. The substrate may be a printed circuit board (PCB). Mobile terminals including a multi-plane antenna and methods of configuring a multi-plane antenna are also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.