Low inductance capacitors, methods of assembling same, and systems containing same
US7724498B2 · kind B2 · utility
6Cited by
14References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 30, 2006 |
| Grant date | May 25, 2010 |
| Priority date | — |
| Expiry date | Oct 15, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/0231
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A low-inductance capacitor exhibits a first characteristic inductance during use in a first capacitor subsection and a second characteristic inductance during use in a second capacitor subsection, and the first and second characteristic inductances act to neutralize each other. A process of forming the low-inductance capacitor includes heat curing. A package includes a low-inductance capacitor and a mounting substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.