Electronic module with heat sink
US7724526B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 10, 2008 |
| Grant date | May 25, 2010 |
| Priority date | — |
| Expiry date | Nov 12, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic module includes a printed circuit board with a heat producing electrical component assembled in an insulating housing. The component is adjacent a thermally conducting heat sink with a thermally conductive material disposed therebetween. Integral with the heat sink is a thermally conductive runner, partially encased in the housing wall, connecting the heat sink to a thermally conductive port. The port is coupled to a base structure when the housing is attached to the base, forming a heat conduction path from the component to the base. This conductive path may also provide an electrical ground path from the printed circuit board to the base.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.