Methods and mechanisms for inserting metal fill data
US7725859B1 · kind B1 · utility
88Cited by
16References
45Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 30, 2004 |
| Grant date | May 25, 2010 |
| Priority date | — |
| Expiry date | Sep 26, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P90/02
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A method for implementing virtual metal fill includes obtaining a layout record for a circuit design, and inserting metal fill data into the layout record based on one or more rules, wherein the metal fill data represents a consolidation of actual metal fill. A method for implementing virtual metal fill includes obtaining a layout record for a circuit design, and inserting metal fill data into the layout record, the metal fill data representing a virtual metal fill having a configuration that is different from a configuration of actual metal fill.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.