Manufacturing method of printed circuit board
US7726016B2 · kind B2 · utility
8Cited by
9References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 26, 2004 |
| Grant date | Jun 1, 2010 |
| Priority date | — |
| Expiry date | Feb 24, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention provides a method of manufacturing a printed circuit board. The method includes the steps of preparing an insulating substrate having a front surface and a back surface and a layer of metal foil formed on each of the front surface and the back surface; selectively forming a plating layer for forming a land on at least one of the metal foils; adjusting a thickness of the plating layer; and forming the metal foils into lines.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.