Thermal valve assembly
US7726584B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 8, 2006 |
| Grant date | Jun 1, 2010 |
| Priority date | — |
| Expiry date | Feb 7, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T137/7737
- WIPO fieldMechanical elements
- WIPO sectorMechanical engineering
Abstract
A thermal valve assembly for a transmission is provided. The thermal valve assembly includes a body having a base portion having a plurality of opposing sidewalls extending therefrom. A cover is mounted with respect to the body and operates to at least partially close the body to form a volume. The base portion defines an inlet orifice, while at least one of the plurality of opposing sidewalls at least partially defines an outlet orifice. A plate is operable to selectively close the inlet orifice. A bi-metallic spring member is disposed at least partially within the volume. The bi-metallic spring member is operable to bias the plate against the base portion. Additionally, the bi-metallic spring member has a variable stiffness characteristic responsive to temperature.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.