Compliant interconnect apparatus with laminate interposer structure
US7726984B2 · kind B2 · utility
Inventors
Key dates
| Filing date | Dec 18, 2007 |
| Grant date | Jun 1, 2010 |
| Priority date | — |
| Expiry date | Jan 5, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R4/26
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Apparatus to electrically connect a first electrical contact to a second electrical contact includes opposed upper and lower elastomer layers formed on either side of an electrically insulating intermediate layer together forming a laminate interposer structure having a thickness. An electrically conducting elastic column to provide a localized conductive path is formed through the thickness of the laminate interposer structure. The upper and lower elastomer layers provide compliance between the upper and lower elastomer layers and the elastic column, and the intermediate layer provides reduced compliance between the intermediate layer and the elastic column relative to the compliance between the upper and lower elastomer layers and the elastic column.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.