Fine treatment agent and fine treatment method using same
US7727415B2 · kind B2 · utility
0Cited by
4References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 19, 2005 |
| Grant date | Jun 1, 2010 |
| Priority date | — |
| Expiry date | Jan 4, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D86/60
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A fine treatment agent according to the present invention is a fine treatment agent for the fine treatment of a multilayer film, including a tungsten film and a silicon oxide film comprising at least one from among hydrogen fluoride, nitric acid, ammonium fluoride and ammonium chloride. Thus, a fine treatment agent which makes fine treatment on a multilayer film, including a tungsten film and a silicon oxide film, possible by controlling the etching rate and a fine treatment method using the same can be provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.