Patent · US Expired

Densification of fibrous structures by resin transfer moulding for making thick parts of composite material

US7727448B2 · kind B2 · utility

13Cited by
14References
13Claims
0Family size

Assignee

Inventors

Key dates

Filing dateDec 16, 2005
Grant dateJun 1, 2010
Priority date
Expiry dateDec 16, 2025

Classification

  • Technology area (CPC B)Performing Operations; Transporting
  • CPC primaryB29C70/443
  • WIPO fieldOther special machines
  • WIPO sectorMechanical engineering

Abstract

A fiber structure for forming the reinforcement of a part to be made is placed in a mold (22) having at least one wall formed by a flexible membrane, and then a resin composition is injected into the mold, the composition having a volatile material content of less than 25% by weight and being at a temperature of a value such that its viscosity lies in the range 0.1 Pa·s to 0.3 Pa·s. The resin is polymerized in the mold placed in an enclosure (20) with temperature being raised progressively and with polymerization including at least a final stage of polymerization under pressure in order to obtain a composite material part presenting residual porosity of less than 11% by volume.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.