Method of manufacturing display device using LED chips formed in a porous template
US7727788B2 · kind B2 · utility
37Cited by
6References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 20, 2006 |
| Grant date | Jun 1, 2010 |
| Priority date | — |
| Expiry date | Oct 30, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S977/949
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for manufacturing a display device using light emitting diode chips contemplates manufacturing a plurality of light emitting diode (LED) chips using a porous template; forming a plurality of first electrodes on a substrate; attaching the LED chips to pixel sites on the first electrodes using fluidic self assembly (FSA); and forming a plurality of second electrodes on a top surface of the LED chips.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.