Micro camera module and method of manufacturing the same
US7728398B2 · kind B2 · utility
4Cited by
13References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 28, 2006 |
| Grant date | Jun 1, 2010 |
| Priority date | — |
| Expiry date | Mar 1, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04N23/57
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A semiconductor chip constituting an image pickup device is provided on a substrate and includes a connection terminal and an image pickup portion. A lens sheet having a lens portion is provided on the semiconductor chip. A groove is formed in at least the substrate to expose the connection terminal. A conductor pattern is formed in the groove and has one end electrically connected to the connection terminal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.