Heat sink apparatus
US7729120B2 · kind B2 · utility
0Cited by
2References
15Claims
0Family size
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Inventors
Key dates
| Filing date | Aug 1, 2008 |
| Grant date | Jun 1, 2010 |
| Priority date | — |
| Expiry date | Aug 1, 2028 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F1/20
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A heat sink apparatus for dissipating heat generated from a heat generating component includes a first heat dissipating assembly attached to one side of the heat generating component, a second heat dissipating assembly attached to another side of the heat generating component; and a connecting device connecting between the first heat dissipating assembly and the second heat dissipating assembly thereby forming a continuous heat dissipation passage between the first heat dissipating assembly and the second heat dissipating assembly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.