Integrated circuit device using substrate-on-insulator for driving a load and method for fabricating the same
US7729147B1 · kind B1 · utility
52Cited by
13References
18Claims
0Family size
Inventors
Key dates
| Filing date | Sep 13, 2007 |
| Grant date | Jun 1, 2010 |
| Priority date | — |
| Expiry date | Jun 20, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH02M7/003
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A semiconductor circuit for driving a load, comprising a transformerless Alternative Current (AC) to Direct Current (DC) converter integrated circuit that includes a high voltage circuit fabricated on a substrate for converting a high voltage AC input signal to a first high voltage DC output signal. Further included is a second circuit fabricated on the same substrate for regulating a drive signal for driving a load using power from the first high voltage output signal, with the high voltage circuit and the second circuit fabricated on the substrate to form a single integrated circuit (IC) chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.