Method for manufacturing a composite material including copper foil and support layer
US7731831B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 7, 2006 |
| Grant date | Jun 8, 2010 |
| Priority date | — |
| Expiry date | Nov 8, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/265
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A composite material useful for the manufacture of a circuit has a support layer, a metal foil layer having opposing first and second sides and a thickness of 15 microns or less and a release layer effective to facilitate separation of the metal foil layer from the support layer, the release layer disposed between and contacting both the support layer and the metal foil layer. A reactive element containing layer, which may be the support layer, effective to react with gaseous elements or compounds to form thermally stable compounds contacts the release layer. The composite material is preferably subjected to a low temperature heat treatment. The combination of the low temperature heat treatment and the reactive element containing layer results in reduced defects including blisters in the copper foil during subsequent processing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.