Method for the fabrication of conductive electronic features
US7732002B2 · kind B2 · utility
71Cited by
109References
37Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 18, 2002 |
| Grant date | Jun 8, 2010 |
| Priority date | — |
| Expiry date | Mar 1, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/207
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Precursor compositions in the form of a tape that can be transferred to a substrate and converted to an electronic feature at a relatively low temperature, such as not greater than about 200° C. The tape composition can be disposed on a carrier to form a ribbon structure that is flexible and can be handled in a variety of industrial processes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.