Thin film array panel and manufacturing method thereof
US7732266B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 14, 2008 |
| Grant date | Jun 8, 2010 |
| Priority date | — |
| Expiry date | Jul 14, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D86/60
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A thin film array panel is provided, which includes: a plurality of signal lines including contact parts for contact with an external device; a plurality of thin film transistors connected to the signal lines; an insulating layer formed on the signal lines and the thin film transistors; and a plurality of pixel electrodes formed on the insulating layer and connected to the thin film transistors, wherein the insulating layer includes a contact portion disposed on the contact parts of the signal lines and having a thickness smaller than other portions and the contact portion of the insulating layer includes an inclined portion having an inclination angle smaller than about 45 degrees.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.