Semiconductor package with getter formed over an irregular structure
US7732902B2 · kind B2 · utility
1Cited by
6References
25Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 5, 2006 |
| Grant date | Jun 8, 2010 |
| Priority date | — |
| Expiry date | May 25, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31678
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A semiconductor package includes a substrate having a first surface portion in a cavity. The first surface portion includes an artificially formed grass structure. The package includes a getter film formed over the grass structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.