Wiring board, electronic circuit board, electronic apparatus and manufacturing method of electronic circuit board
US7732935B2 · kind B2 · utility
0Cited by
10References
17Claims
0Family size
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Key dates
| Filing date | Apr 20, 2006 |
| Grant date | Jun 8, 2010 |
| Priority date | — |
| Expiry date | Aug 25, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/162
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A wiring board includes a substrate made of an insulation material and wired by a conductive material. A plurality of electrodes is formed on a surface of the substrate. A non-Au electrode not having an Au surface layer and an Au electrode having the Au surface layer are formed as the electrodes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.