Sensor surface with 3D curvature formed by electronics on a continuous 2D flexible substrate
US7733397B2 · kind B2 · utility
10Cited by
4References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 22, 2006 |
| Grant date | Jun 8, 2010 |
| Priority date | — |
| Expiry date | Sep 18, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04N25/702
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of making a curved sensor is described. The method involves projecting portions of a curved three dimensional structure such as a hemisphere onto a two dimensional substrate in an outline pattern. The outline pattern typically serves as a perimeter of a sensor. After forming a sensor in the shape of the outline pattern, the two dimensional substrate is flexed to form a three dimensional sensor structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.