Optical device module, optical path fixing device, and method for manufacturing optical device module
US7733408B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 23, 2006 |
| Grant date | Jun 8, 2010 |
| Priority date | — |
| Expiry date | Feb 7, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A solid-state image sensor, a transparent cover, a DSP, a wiring board and the like are sealed in a sealing portion by molding of a synthetic resin, and fixed to an imaging unit. At this time, a portion of the transparent cover is exposed from the sealing portion. The optical path fixing device and the imaging unit sealed by the sealing portion are fixedly combined by engagement of hook engaging portions and hook portions, in a state where the lower end surface of a lens barrel comes into contact with the exposed portion. As the result, positioning accuracy of a lens with respect to a pixel area of the solid-state image sensor dose not deteriorate even if a substrate on which the solid-state image sensor is arranged is deflected or distorted.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.