Laser bond inspection using annular laser beam
US7735377B1 · kind B1 · utility
6Cited by
32References
22Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Mar 2, 2009 |
| Grant date | Jun 15, 2010 |
| Priority date | — |
| Expiry date | Mar 2, 2029 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N19/04
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Methods, systems, and apparatuses are provided for generation of focused stress waves that selectively apply tensile stress to local regions of a bonded article.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.