Method for manufacturing capacitor embedded in PCB
US7736397B2 · kind B2 · utility
16Cited by
9References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 5, 2007 |
| Grant date | Jun 15, 2010 |
| Priority date | — |
| Expiry date | Nov 25, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/435
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for manufacturing a capacitor embedded in a PCB includes: preparing a copper clad lamination (CCL) substrate having a reinforcement member and copper foils formed on both surfaces of the reinforcement member; planarizing surfaces of the copper foils of the CCL substrate; forming a dielectric layer on the planarized surface of the copper foils; and forming a top electrode on the dielectric layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.