Surface treatment method for solder joint
US7736445B2 · kind B2 · utility
1Cited by
0References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 15, 2007 |
| Grant date | Jun 15, 2010 |
| Priority date | — |
| Expiry date | Jul 2, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0793
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A surface treatment method for solder joint employs alkali buffer solution dipping the solder joint and the alkali buffer solution reacts with the solder joint thus yielding a passive layer. As the resultant passive layer forms on the surface of the solder joint, thereby prevents further corrosion and dissolution during aqueous cleaning or water dipping thereafter. In addition, the passive layer ensures a good appearance with maximum protection of the solder joint and also provides a sound reliability and a high testability of a finished electronic product equipped with the solder joint.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.