Nano icrystals copper material with super high strength and conductivity and method of preparing thereof
US7736448B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 16, 2003 |
| Grant date | Jun 15, 2010 |
| Priority date | — |
| Expiry date | Aug 1, 2027 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC22C1/00
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
The present invention relates to a nanocrystalline metallic material, particularly to nano-twin copper material with ultrahigh strength and high electrical conductivity and its preparation method. High-purity polycrystalline Cu material with a microstructure of roughly equiaxed submicron-sized grains (300-1000 nm) has been produced by pulsed electrodeposition technique, by which high density of growth-in twins with nano-scale twin spacing were induced in the grains. Inside each grain, there are high densities of growth-in twin lamellae. The twin lamellae with the same orientations are inter-parallel, and the twin spacing ranges from several nanometers to 100 nm with a length of 100-500 nm. This Cu material invented has more excellent performance than existing ones. The tensile yield strength and ultimate strength of the present Cu material at room-temperature can be as high as 900 MPa and 1086 MPa, respectively, and such a high tensile strength can not be achieved for the Cu materials with the same chemical composition prepared by any traditional methods. Meanwhile, the present Cu sample also keeps a good electrical conductivity, for example, the room-temperature resistivity is (1.…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.