Heat curable, thermally expandable composition with high degree of expansion

US7736743B2 · kind B2 · utility

Assignee

• Henkel AG & Co. KGaA · DE

Inventors

• Xaver Muenz · Heidelberg, DE
• Larissa Bobb · Leimen, DE

Key dates

• Filing date: Jul 18, 2005
• Grant date: Jun 15, 2010
• Expiry date: Dec 13, 2027

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T428/31529
• WIPO field: Macromolecular chemistry, polymers
• WIPO sector: Chemistry

Abstract

Compositions containing at least one liquid epoxy resin, at least one solid epoxy resin, at least one propellant, at least one curing agent and at least one mica-containing filler produce expandable, thermally curable binder systems which may be used without the addition of hollow glass beads for the production of stiffening and reinforcing laminates and for the production of stiffening and reinforcing moldings. Said laminates according to the invention are suitable for the stiffening and reinforcing of components, in particular in the automotive industry, such as car body frames, doors, boot lids, engine bonnets and/or roof parts. In addition, the mouldings that may be produced from said binders are suitable for the stiffening and reinforcing of hollow metal structures, in particular of hollow car body parts such as body frames, body supports and posts or doors in the automotive industry.